At the recent IEDM conference, TSMC unveiled a product roadmap for its semiconductors and next-generation production nodes that culminates in eventually delivering multiple 3D-stacked collections of chiplet...
Exactly my thought. The article seems like a good general overview of emerging trends, though. This is the first I’ve heard of backside power delivery.
Exactly my thought. The article seems like a good general overview of emerging trends, though. This is the first I’ve heard of backside power delivery.