At the recent IEDM conference, TSMC unveiled a product roadmap for its semiconductors and next-generation production nodes that culminates in eventually delivering multiple 3D-stacked collections of chiplet...
  • @crystalmerchant@lemmy.worldEnglish
    17•6 months ago

    The fuck kind of headline is this?? Every chipmaker is “working towards” this omnipresent goal of smaller, faster, cheaper. No shit sherlock

    • @CanadaPlusEnglish
      2•6 months ago

      Exactly my thought. The article seems like a good general overview of emerging trends, though. This is the first I’ve heard of backside power delivery.